RFIC/mm-Wave IC Research / Design Openings:  Visiting Professors / Visiting Scholars / Experienced Engineers

Join our fast-growing RFIC and millimeter-wave IC design team, responsible for all aspects of RF silicon development with a particular emphasis on highly integrated and efficient designs and technologies for 5G and satellite communications. Do you want to be in a highly visible role at the center of a silicon design team, guide post-graduates and exert a critical impact on getting functional products to hundreds of millions of customers quickly? We have multiple needs and are open to multiple experience levels.

We need an MSEE or PhDEE, with 3 or more years in RF IC Design over 6GHz. We do ICs in CMOS and SiGe BiCMOS, but any high frequency IC design in Silicon would be applicable.

Job Description 

Important role in developing innovative circuits for 5G and Satcom networks. In this highly promising position, you will contribute to the system-level development of the-state-of-the-art millimeter-wave front-ends and determine the system architectures for next generation communication circuits. We are looking for highly self-motivated and talented problem-solvers with strong IC design skills as well as solid EM and communication systems background.

Responsibilities

• Design mm-wave IC’s such as power amplifiers, LNA’s, phase shifters, up/down converters and PLLs.

• Develop mm-wave communication front-end systems and determine the system architectures for the complete signal chain from antenna to bits.

• Determine the IC level implications of system-level requirements of next generation communication networks.

• Design and simulate on-chip EM structures as well as IC/package interfaces.

Requirements

• 3+ years of experience in millimeter-wave/RF IC design in SiGe and CMOS.

• Extensive experience in mm-wave amplifiers, up/down converters, PLLs and phase shifters.

• Deep understanding of RF circuits design fundamentals and RF communication architectures.

• Solid foundation in electromagnetics theory and communication systems. 

• Experience in EM simulations both for on-chip and package parts.

• Good communication skills and effective team work.

Salary: up to USD70,000 / year

Email: wdzyjy@cuit.edu.cn;        

Phone: +86 28 61956930

More information about Chengdu University of Information Technology：http://english.cuit.edu.cn/